Download Arbitrary Modeling of TSVs for 3D Integrated Circuits by Khaled Salah,Yehea Ismail,Alaa El-Rouby PDF

By Khaled Salah,Yehea Ismail,Alaa El-Rouby

This e-book provides a wide-band and expertise self sustaining, SPICE-compatible RLC version for through-silicon vias (TSVs) in 3D built-in circuits. This version money owed for quite a few results, together with dermis impression, depletion capacitance and within sight touch results. Readers will make the most of in-depth insurance of suggestions and expertise corresponding to 3D integration, Macro modeling, dimensional research and compact modeling, in addition to closed shape equations for the via silicon through parasitics. techniques lined are tested by utilizing TSVs in functions comparable to a spiral inductor and inductive-based communique process and bandpass filtering.

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